CHANDLER, (Arizona): Intel Corp on Friday said it has won a second-phase contract in a project aimed at helping the US military make more advanced semiconductors within the United States.

Under the project, Intel will help the military develop prototypes of chips using its semiconductor packaging technology at factories in Arizona and Oregon. The packaging technology allows pieces of chips called “chiplets” from different providers to be combined into one package, helping cram more features into a smaller finished product.